LINK-OWD-SRA-C-FOUP-12

12-inch FOUP omnidirectional semiconductor embodied robot, which addresses the automated handling of carriers such as wafer cassettes in the wafer manufacturing processes of semiconductors. Specifically developed for the semiconductor industry, the composite robot uses a collaborative robotic arm to handle common types of carriers in wafer manufacturing, such as FOUP, FOSB, and BOX, completing the transportation and loading/unloading of wafers.